Guangrui Xia, University of British Columbia

Research

edge emitting lasers fabrication failure mechanism germanium on-chip optical communication optical sensing photo-electronic integration reliability

Latest papers

Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain.
ACS omega · 2024 · senior author
Sub-10 μm-Thick Ge Thin Film Fabrication from Bulk-Ge Substrates via a Wet Etching Method.
ACS omega · 2023 · senior author

All 2 publications

Latest funding

Germanium for next-generation semiconductor lasers
NSERC · 2023 · Principal investigator
$84,000
Germanium for next generation photonic and microelectronic devices
NSERC · 2017 · Principal investigator
$144,000
Modeling and simulations of SiGe interdiffusion and ion implantation in CSUPREM
NSERC · 2013 · Principal investigator
$40,000

All 5 grants and awards

2 publications.

01

Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain.

Wang L, Xia G

ACS omega2024Senior author

DOI: 10.1021/acsomega.3c09980 PMID: 38434815

02

Sub-10 μm-Thick Ge Thin Film Fabrication from Bulk-Ge Substrates via a Wet Etching Method.

Wang L, Zhu Y, Wen RT, Xia G

ACS omega2023Senior author

DOI: 10.1021/acsomega.3c07490 PMID: 38162769

Germanium for next-generation semiconductor lasers

Principal investigatorNSERC2023Discovery Grants Program - Individual

Principal investigators: Xia, Guangrui

Keywords: germanium; edge emitting lasers; fabrication; semicondcutor processing; on-chip optical communication; vertical cavity surface emitting; reliability; failure mechanism; photo-electronic integration; optical sensing

$84,000

Germanium for next generation photonic and microelectronic devices

Principal investigatorNSERC2017Discovery Grants Program - Individual

Principal investigators: Xia, Guangrui

$144,000

Modeling and simulations of SiGe interdiffusion and ion implantation in CSUPREM

Principal investigatorNSERC2013Collaborative Research and Development Grants

Principal investigators: Xia, Guangrui

$40,000

Three-dimensional stress and Si-Ge interdiffusion modeling for semiconductor process simulation software CSUPREM

Principal investigatorNSERC2010Collaborative Research and Development Grants

Principal investigators: Xia, Guangrui

$39,840

SiGe and stress technology for next generations of high performance electronic and photonic devices

Principal investigatorNSERC2009Discovery Grants Program - Individual

Principal investigators: Xia, Guangrui

$140,000

From CIHR, NSERC and SSHRC funding decisions: CIHR since 2008, NSERC since 1991 and SSHRC since 1998, including their latest published competition results.

Write to this professor

A short, specific email works best. This draft uses one of their recent papers; replace the parts in brackets with your own details before sending.

Applying for

Paper to mentionMention their NSERC grant from 2023

Subject: Prospective PhD student: edge emitting lasers Dear Professor Xia, My name is [your name], and I am a [your current degree or role] at [your institution]. I am applying for a PhD position starting in [term and year]. I read your paper "Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain." (2024), and it connects closely to my own work on [your research topic]. [One or two sentences on what you did and what you learned.] I also saw your NSERC-funded project "Germanium for next-generation semiconductor lasers" (2023), and I would be glad to contribute to work in that direction. Are you accepting new PhD students for [term and year]? I have attached my CV and transcripts, and I would be glad to talk at a time that suits you. Thank you for your time. Kind regards, [your name]

Guangrui Xia

Research

Latest papers

Latest funding

Ultrahigh-Quality Ge-on-Glass with a 3.7% Uniaxial Tensile Strain.

Sub-10 &#x3bc;m-Thick Ge Thin Film Fabrication from Bulk-Ge Substrates via a Wet Etching Method.

Germanium for next-generation semiconductor lasers

Germanium for next generation photonic and microelectronic devices

Modeling and simulations of SiGe interdiffusion and ion implantation in CSUPREM

Three-dimensional stress and Si-Ge interdiffusion modeling for semiconductor process simulation software CSUPREM

SiGe and stress technology for next generations of high performance electronic and photonic devices

Sub-10 μm-Thick Ge Thin Film Fabrication from Bulk-Ge Substrates via a Wet Etching Method.