Faculty profile
Michael Mayer
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Latest papers
Measure for optical robustness of directly bonded glass-to-glass joint using its interaction with damage induced by fs laser
Review of Scientific Instruments · 2024 · senior author
Direct glass-to-glass bonding obtained via simplified ammonia-based low-temperature procedure resists high shear stress and powerful CW fiber laser irradiation
RSC Advances · 2022 · senior author
Miniature environmental chambers for temperature humidity bias testing of microelectronics.
The Review of scientific instruments · 2017 · senior author
Latest funding
- $168,000
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
NSERC · 2018 · Principal investigator
- $24,613
Development of Wire Bonding Process and Reliability Evaluation for Gold coated Selenium
NSERC · 2017 · Principal investigator
- $68,481
Metallizing technologies for organometallic liquids
NSERC · 2016 · Principal investigator
5 publications.
Measure for optical robustness of directly bonded glass-to-glass joint using its interaction with damage induced by fs laser
Zhou J, Zhou YN, Mayer M
Direct glass-to-glass bonding obtained via simplified ammonia-based low-temperature procedure resists high shear stress and powerful CW fiber laser irradiation
Zhou J, Mei N, Leonenko Z, Zhou N, Mayer M
Miniature environmental chambers for temperature humidity bias testing of microelectronics.
Hook MD, Mayer M
Effect of Ultrasonic Capillary Dynamics on the Mechanics of Thermosonic Ball Bonding
Huang Y, Shah A, Mayer M, Zhou N, Persic J
Symmetric miniaturized heating system for active microelectronic devices.
McCracken M, Mayer M, Jourard I, Moon JT, Persic J
Models for Initiation and Growth of Microwelds in Ultrasonic Bonding
Principal investigators: Mayer, Michael
Development of Wire Bonding Process and Reliability Evaluation for Gold coated Selenium
Principal investigators: Mayer, Michael
Metallizing technologies for organometallic liquids
Principal investigators: Mayer, Michael
Resistance monitoring of novel solders during processing and operation at high temperatures
Principal investigators: Mayer, Michael
Mechanical property indentation tester
Principal investigators: Gerlich, Adrian
Development of novel palladium coated bonding wire for microelectronics
Principal investigators: Mayer, Michael
Gentle methods to bond microwires to delicate substrates
Principal investigators: Mayer, Michael
Study of ultrasonic wire bonding for power applications
Principal investigators: Mayer, Michael
Erbium fiber laser and Its peripherals for microsystems development
Principal investigators: Toyserkani, Ehsan
Study of mechanisms in thermosonic wire bonding.
Principal investigators: Mayer, Michael
From CIHR, NSERC and SSHRC funding decisions: CIHR since 2008, NSERC since 1991 and SSHRC since 1998, including their latest published competition results.
Frequent collaborators
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