Faculty profile
David Danovitch
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Research
Latest papers
Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives.
ACS sustainable chemistry & engineering · 2025
Latest funding
- $82,544
Chemical mechanical planarization a technology enabler for devices, circuits and microsystems innovation
NSERC · 2024 · Co-investigator
- $345,700
Integration of a Bio-sourced epoxy for the reduction of BPA and petro-chemical agents in the microelectronics packaging eco-system
NSERC · 2023 · Co-investigator
- $200,000
Materials and Processes for Improved Photonic Package Stability
NSERC · 2022 · Principal investigator
1 publications.
Sticking to Green: Sustainable Solutions for Next-Generation Microelectronic Packaging with Plant-Derived and Bacterial Adhesives.
Berne C, Marsan-Loyer C, Weiss LE, Brun Y, Danovitch D, Gendron D, Ecoffey S
Chemical mechanical planarization a technology enabler for devices, circuits and microsystems innovation
Principal investigators: Ecoffey, Serge
Keywords: Advanced packaging; Chemical mechanical planarization; MEMS; Microfabrication; Nanoelectronic; Nanopatterning; Polishing; Semiconductor devces; Surface preparation; Wafer bonding
Integration of a Bio-sourced epoxy for the reduction of BPA and petro-chemical agents in the microelectronics packaging eco-system
Principal investigators: Ecoffey, Serge S
Keywords: advanced packaging; bio-sourced material; epoxy; life cycle analysis; microelectronic; polymer; recycling; societal impact
Materials and Processes for Improved Photonic Package Stability
Principal investigators: Danovitch, David DH
Keywords: fibre attach; flip chip assembly; laser assisted bonding; low temperature; microelectronic packaging; photonics integrated circuit; solder; solid liquid interdiffusion; underfill; warpage
Novel solder structures for high reliability flip chip applications - Scaling to high-density applications
Principal investigators: Danovitch, David
3D microscopy from nanoelectronics devices to integrated systems
Principal investigators: Drouin, Dominique
Low Temperature Interconnections for High Performance Heterogeneous Integration
Principal investigators: Danovitch, David
Materials and ARchitectures of Solar cells for CPV (MARS CPV)
Principal investigators: Arès, Richard
Gold Stud Bump Flip chip Attach for Silicon Photonics Packaging
Principal investigators: Danovitch, David
Heterogeneous integration of high-density analog crossbar for advanced data processing
Principal investigators: Drouin, Dominique
Modules photovoltaïques pour capteur solaire thermique-photovoltaïque
Principal investigators: Danovitch, David
From CIHR, NSERC and SSHRC funding decisions: CIHR since 2008, NSERC since 1991 and SSHRC since 1998, including their latest published competition results.
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