Luc Fréchette

Chemical mechanical planarization a technology enabler for devices, circuits and microsystems innovation

Principal investigators: Ecoffey, Serge

Keywords: Advanced packaging; Chemical mechanical planarization; MEMS; Microfabrication; Nanoelectronic; Nanopatterning; Polishing; Semiconductor devces; Surface preparation; Wafer bonding

Développement d'un procédé manufacturable pour la fabrication de guides d'ondes dans les isolateurs - Faraday Rotator

Principal investigators: Ecoffey, Serge S

Keywords: assemblage avancé; collage; guides d'ondes dans les isolateurs; intégration; microfabrication; moulage; photonique

Ingénierie de la microstructure de couches minces pour l'industrie de la microélectronique

Principal investigators: Braidy, Nadi N

Keywords: bolométrie; caractérisation; céramiques; déposition; dopage des films; fabrication microélectronique; films minces; microscopie électronique; oxydes; pellicules

BOREAS - Advanced thermal management technologies for Li-ion battery modules

Principal investigators: Fréchette, Luc LG

Keywords: batteries; cooling; electric vehicles; fabrication; heat pipe; heat transfer; immersion; polymers; thermal management

Collaboration to develop manufacturing methods of electric microreactors for clean hydrogen production

Principal investigators: Picard, Mathieu

Self-adaptive heat sink - I2I Phase I

Principal investigators: Fréchette, Luc

Market assessment of self-regulated heat sink device for uniform temperature distribution

Principal investigators: Fréchette, Luc

Market assessment of polymeric heat pipes for thermal management of Li-ion batteries

Principal investigators: Fréchette, Luc

Feasibility study for the integration of a microfluidic cooling system and heat spreading on a microelectronics chip

Principal investigators: Fréchette, Luc

Smartflex - Laminated MEMS and Microfluidics

Principal investigators: Fréchette, Luc

Keywords: additive manufacturing; Energy Harvesting; Internet of Things; lamination; MEMS; microfabrication; microfluidics; Packaging; printed electronics; Thermal management